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FUJI NXT M3II High Speed SMT PCB Manufacturing Pick And Place PCB Assembly Equipment

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FUJI NXT M3II High Speed SMT PCB Manufacturing Pick And Place PCB Assembly Equipment

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Brand Name :FUJI
Model Number :NXT M3II
Place of Origin :Japan
MOQ :1 pcs
Price :USD+negotiable+pcs
Payment Terms :T/T
Supply Ability :1+pcs+per days
Delivery Time :1-7 days
Packaging Details :1700*1700*2100mm
Model :M3II
Series :Fuji NXT Series
Category :SMT (Surface Mount Technology) pick-and-place machine
Accuracy :±0.03 mm (placement precision, using vision recognition)
Type :Intelligent, automatic, and manual exchangeable feeder system
Number of Feeders :Supports up to 130 feeders per module depending on configuration
Feeder Types :Tape feeders, tray feeders, bulk feeders, and stick feeders
Maximum PCB Size :508 mm x 610 mm (with dual-lane configuration)
Minimum PCB Size :50 mm x 50 mm
PCB Thickness :Supports a wide range of PCB thicknesses from 0.3 mm to 4.0 mm
Multi-Nozzle Placement Heads :Available in different configurations to meet various production requirements
Types of Heads :Standard, high-speed, or multi-function heads that can place components at different speeds and sizes
Power Supply :3-phase, 200-230V AC, 50/60Hz
Energy Efficiency :Designed for optimized power usage to reduce operational costs
Machine Dimensions :Approximately 1,200 mm (L) x 1,200 mm (W) x 1,600 mm (H)
Weight :Approx. 1,200 kg (depending on configuration)
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The FUJI NXT M3II is a high-performance, modular SMT (Surface Mount Technology) pick-and-place machine widely used in electronics manufacturing for mounting components on printed circuit boards (PCBs). Here’s an overview of its key functions and features:

Machine Functions:

1. High-Speed Placement:

- Capable of placing a wide range of components at high speed with precision, from microchips to larger components.

2. Modular Configuration:

- The M3II is part of Fuji’s NXT series, allowing for modular machine configuration. Each module can be customized based on production needs, allowing scalability and flexibility.

3. Multi-Nozzle Heads:

- Equipped with multiple nozzles on the placement heads, enabling simultaneous handling of different components, further increasing efficiency.

4. Component Versatility:

- Can place both standard surface-mount devices (SMDs) and odd-shaped components, providing a broad application range in electronics manufacturing.

5. Automatic Feeder Exchange:

- The system supports automatic and manual feeder exchange, which reduces downtime and enhances productivity.

6. Camera Inspection:

- The machine uses a vision system with cameras to align components accurately and verify their placement before soldering.

7. Inline Operation:

- Designed to work in a production line with other SMT machines, facilitating continuous and automated PCB assembly processes.

8. Placement Accuracy:

- High placement accuracy due to advanced control and vision systems, which help ensure that components are placed correctly on the PCB.

Features:

1. Compact Design:

- The M3II is designed to have a compact footprint, making it space-efficient for production lines.

2. Smart Factory Compatibility:

- It supports Industry 4.0 technologies, including smart factory integration, for data collection, machine learning, and process optimization.

3. User-Friendly Interface:

- The machine interface is intuitive and easy to use, allowing operators to quickly set up and monitor the production process.

4. Intelligent Feeders:

- Feeder systems in the M3II are intelligent, allowing for quick recognition of component types and minimizing errors in component selection.

5. Multi-Function Heads:

- The placement heads are interchangeable and capable of performing various functions, including component recognition, placement, and sometimes solder paste inspection.

6. Quick Changeover:

- The machine is designed for fast changeover between product types, allowing manufacturers to quickly adapt to different PCB assemblies.

7. Energy Efficiency:

- Advanced control systems optimize power consumption, contributing to energy savings and reducing the overall operating costs.

Additional Capabilities:

- Dual Lane Configuration: Offers a dual-lane setup for parallel production of different PCBs, enhancing throughput.

- PCB Handling: Supports flexible PCB handling options for both large and small boards, adapting to various design requirements.

The FUJI NXT M3II is favored for its adaptability, high speed, and precision, making it ideal for large-scale PCB manufacturing in industries like automotive, consumer electronics, and telecommunications.

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FUJI NXT M3II High Speed SMT PCB Manufacturing Pick And Place PCB Assembly Equipment

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