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High productivity
一, Optimization of Mini LED Production
This is a highly precise equipment that uses 20 Spindle Rotary Head and can produce Mini LEDs with a size of 0.2x0.1mm. The Wafer Handling Unit is utilized to achieve a maximum production capacity of 65,000 CPH.
二, High-speed and High-precision LED Ejecting
The ejector is precisely controlled by a lightweight and high-precision motor along the X/Y/Z axes. When the suction nozzle at the head sucks the LED, the ejector moves along the X/Y/Z axes and supports the LED bottom surface of the Wafer.
三, Optimizing the Supply of Mini LED (Hoof Ring + Reel Feeder)
This is a device that can use both Hoof Ring WaferType and Reel Feeder simultaneously. There are 4 Feeder Slots in the Reel Feeder.
It is equipped with a Reel Cutter, making it easy to manage the discarded round material discs.
※ Reel Feeder: Option
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